MeLE Mini PCs Win Red Dot Design Award

2024-04-18 16:05:59 mele 19

The winners of the 2024 Red Dot Award have been officially announced recently. MELE TECHNOLOGIES (SHENZHEN) CO., LTD.  has been honored with the Red Dot Design Award for its Fan-less Mini PC Stick Pro Series and Slim Mini PC Overclock Series. This marks another innovative milestone for MeLE, following the three Mini PC products winning the American MUSE Design Award in 2023.

        The Red Dot Award is one of the most prestigious design awards in the world, alongside the German IF Award and the American IDEA Award. Organized by the Design Zentrum Nordrhein Westfalen in Germany, the Red Dot Award has been renowned since its establishment in 1955 for its rigorous evaluation criteria and outstanding design quality. Red Dot Award aims to recognize companies and designers worldwide who have achieved outstanding accomplishments in product design, innovation, and functionality. It not only represents the highest honor in design quality and innovation but also makes a significant contribution to the development and progress of the global design industry.

        Innovation has been one of the most important aspects of MeLE's corporate culture since its founding 20 years ago. It is the differentiation competitive strategy that MeLE uses to create value for its customers, as well as the driving force behind MeLE's provision of high-quality products to global customers.

        The mini PC industry is a pioneering sector in the desktop computer market that aligns with the development concept of energy conservation, environmental protection, and carbon reduction. It is widely used in education, office, commercial, IoT, and similar industries with low computing power requirements. Most competitors in the market imitate the Intel NUC series, with product thickness exceeding 5 centimeters (2 inches). MeLE R & D team based on the usage characteristics of mini PCs and after long-term research and innovative application of manufacturing processes that eliminate air insulation between metal alloys and high thermal conductivity engineering plastics, has successfully solved the contradiction between improving heat dissipation efficiency and preventing exterior scalding. MeLE Fanless Mini PC achieved fanless heat dissipation and controlled product thickness within 2 centimeters (0.8 inches), creating an ultra-thin size that allows users to conveniently mount the mini PC on a VESA MOUNT behind a slim LCD monitor.

The MeLE Fan-less Mini PC Stick Pro Series challenges the size limits of consumer mini PCs, offering multifunctionality, high performance, noise-free operation, long lifespan, and cost-effectiveness. It can be easily carried in a pocket like a smartphone. MeLE's innovative patented technology uses high thermal conductivity engineering plastics and aluminum alloy heat sinks, combined with a unique in-mold integration technology. This allows the heat generated during operation to be quickly transferred to the surface of the product. The surface texture of the tetrahedral shell increases the heat dissipation area of the product by 2.6 times, greatly improving the heat dissipation capability of the mini PC and enabling the MeLE PC STICK Pro Series to have a strong heat dissipation capacity of up to TDP8W.

The innovative design not only minimizes contact between the user's hand and the body of the product when holding it but also significantly reduces the perceived temperature of the user's fingers when in contact, surpassing the lifespan limitation of fan-based mini PCs. The MeLE Fan-less Mini PC Stick Pro Series is equipped with the latest Intel Celeron processor chip, which can sustainably improve performance through iterative updates. It offers a variety of configuration options to meet user needs, with dimensions of 146×61×20 millimeters (5.75*2.4*0.79 inches) and a weight of 182 grams. It can be widely used in homes, schools, governments, enterprises, digital signage, smart building controls, IoT edge computing, machine learning, and other applications.

The MeLE Slim Mini PC Overclock Series is a mini computer that is "ultra-thin, low power consumption, small in size, and high performance." It uses fan cooling technology to increase the Thermal Design Power (TDP) related to CPU computing capability to 15W, while maintaining its ultra-thin and extremely small size. This results in a performance increase of at least 30% in computing power.

In order to maximize the performance of the Intel processor and control the volume of all internal heat dissipation components to achieve the design goal of ultra-thin and small volume, the MeLE Slim Mini PC Overclock Series fully utilizes the rapid heat transfer properties of thermal conduction principles and phase change media. It uses a pure copper heat pipe to quickly "transport" the heat from the processor to the copper fins arranged horizontally with the computer motherboard and the centrifugal heat dissipation silent fan module outside the heat source, rapidly dissipating the heat out of the body to achieve efficient heat dissipation.

The thickness of the MeLE Slim Mini PC Overclock Series is only 19.5mm (0.77 inches), with a volume of only 0.33 liters, visually similar to the size of a smartphone. It comes with a variety of interfaces, allowing simultaneous connection to three displays for parallel work on different tasks. It features built-in wifi 6 and Bluetooth 5.2, supports headphone and Mircro SD insertion, and users can also expand DDR memory and SSD storage space according to their needs. 

Combining its performance and rich functional interfaces, it is ideal for office, industrial IoT, MES manufacturing execution, digital signage, smart building control, machine learning, and other fields. It is also a perfect substitute for home ATX standard desktop computers.

Additionally, the MeLE Slim Mini PC Overclock Series intelligently manages the operation of the heat dissipation fan through the embedded controller chip, which can intelligently match the fan speed according to the computer's operating power, effectively reducing the noise and fan bearing wear during fan operation. This extends the average lifespan of the product by at least three years compared to mini computers with ordinary carry-on heat dissipation fans.

MELE TECHNOLOGIES (SHENZHEN) CO., LTD. is a high-tech enterprise specializing in the research and development, production, marketing, and brand operation of products such as mini computers, commercial video conferencing systems, machine vision applications, and IoT. We provide product design and manufacturing services to over 80 countries and regions worldwide.